DOOSUNG CO., Ltd.

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PRODUCTS

Total EMC / Thermal Products

IDHT G series - Gel type TIM

Structure and Features

Features

IDHT G series is very soft, freestanding gap filler that is more compressible than any other gap filler.

IDHT-G series has not only good thermal conductivity of 1.5~10.0W/m·K but also high compressibility, which leads to low thermal impedance.

IDHT-G series is inherently sticky, so not necessary to use additional adhesive coating which deteriorates thermal performance.

IDHT-G series is electrically insulated and stable from –40℃ to 200℃.

Applications

Cooling Components to the Chassis or Frame

High Speed Mass Storage Drives

RDRAM Modules

Micro Processors, Memory Chips and Chipsets

Thermal Solution for Heat Pipe

Automotive Engine Control Units

Telecommunication Hardwares

Specifications

Specifications
Item
Content
IDHT G Series (1.5~2.0W/m∙K)
(S)-G1540 (S)-G1550 (S)-D1550 G1560 G1560BV (S)-G1850 G1
Color Gray Gray Dark Gray Gray Sky Blue Gray Gray
Thickness (mm) 0.5~20.0 0.5~20.0 0.5~20.0 0.5~10.0 0.5~15.0 0.5~20.0 0.5~10.0
Thermal Conductivity (W/m·K) 1.5 1.8 2.0
Hardness (Shore 00) 40 50 50 60 60 50 < 40
Specific Gravity 2.6 2.57 2.57 1.8 1.8 2.57 2.5
Volume Resistivity (Ω·cm) - 1.0×1014 1.0×1014 1.0×1011 1.0×1011 1.0×1014 1.0×1011
Voltage Breakdown (kV) - - - 5.1 5.1 - > 6
Service Temp. (℃) -60 ~ 200 -60 ~ 200 -60 ~ 200 -40 ~ 200 -40 ~ 200 -60 ~ 200 -40 ~ 200
Specifications
Item
Content
IDHT G Series (3.0~6.0W/m∙K)
G3030 G3050 G3050PV (S)-G3060 G4050 G5050 (S)-G5070 G6050 G6050BV
Color Gray Gray Pink Gray Gray Gray Gray Gray Sky Blue
Thickness (mm) 0.5~10.0 0.5~3.5 0.5~3.5 0.25~11.0 0.5~10.0 0.5~10.0 0.5~20.0 0.5~10.0 0.5~10.0
Thermal Conductivity (W/m·K) 3.0 4.0 5.0 6.0
Hardness (Shore 00) 30 50 50 60 60 50 70 50 50
Specific Gravity 2.8 2.86 2.86 2.95 1.8 3.0 3.15 3.0 3.0
Volume Resistivity (Ω·cm) 1.0×1011 1.0×1011 1.0×1011 1.0×1012 1.0×1011 1.0×1011 1.0×1013 1.0×1011 1.0×1011
Voltage Breakdown (kV) > 6 > 6 > 6 - 5.1 - - - -
Service Temp. (℃) -40 ~ 200 -40 ~ 200 -40 ~ 200 -30 ~ 200 -40 ~ 200 -40 ~ 200 -40 ~ 200 -40 ~ 200 -40 ~ 200

Selection Guide

How to Order

P/N :
IDHT 1
-
AAA 2
-
G 3
-
BBB 4
-
CCC 5
-
DDD 6
-
EEE 7
-
FFF 8
-
GGG 9
-
HHH 10
  • 1 Heat Transfer : none or (S)

  • 2 Thickness (mm)

  • 3 Type (G : gel type)

  • 4 Powder Filler (****)

  • 5 Width (mm)

  • 6 Length (mm)

  • 7 Tape type : A(100㎛), A1(50㎛), C(none)

  • 8 Tacky Type : O(One Side Tacky), B(Both Side Tacky)

  • 9 None : Rectangular type, S : Shape type

[ For Example ]
IDHT(S)-0.5-G1550-210-300-C

Thickness : 0.5mm

Powder Filler : G1550

Width : 210mm

Length : 300mm

Tape Type : C(none)

Rectangular type

[ For Example ]
IDHT-0.5-G1560-210-300-A-S

Thickness : 0.5mm

Powder Filler : G1560

Width : 210mm

Length : 300mm

Tape Type : A(100㎛)

Shape type

IDHT-S series - Sheet type TIM

Structure and Features

Features

IDHT-S1 has high thermal conductivity of 4.0W/m·K to produce low thermal impedance.

IDHT-S1 is electrically insulating, stable from –30℃ to 200℃.

Available in various thickness from 0.1mm to 0.35mm

IDHT-S1 does not require reinforcement.

Not only the lowest thermal resistance but the highest dielectric strength are the distinctive characteristics of IDHT-S1.

Applications

CPU / Heat Sink

Power Devices, Voltage Regulators / Heat Sink

PCB / Heat Sink

PCB / Case or Chassis

CD ROM drive / Case

PCB / PCB

Specifications

Specifications
Content IDHT-S1
Color White
Thickness (mm) 0.1 ~0.35
Hardness (Shore A) 60
Specific Gravity 2.7
Thermal Conductivity (W/m·K) 4.0
Volume Resistivity (Ω·cm) 1.0×1011
Voltage Breakdown (kV) 5.1
Tensile Strength (MPa) 15
Service Temp. (℃) - 30 ~ 200

How to Order

P/N :
IDHT 1
-
AAA 2
-
S 3
1 4
-
BBB 5
-
CCC 6
-
DDD 7
-
EEE 8
  • 1 Heat Transfer

  • 2 Thickness (mm) : 010 means 0.10mm

  • 3 Type (S : sheet type)

  • 4 Powder Filler

  • 5 Width (mm)

  • 6 Length (mm)

  • 7 Tape type

  • 8 S : Press, N : None Press