Total EMC / Thermal Products
IDHT G series is very soft, freestanding gap filler that is more compressible than any other gap filler.
IDHT-G series has not only good thermal conductivity of 1.5~10.0W/m·K but also high compressibility, which leads to low thermal impedance.
IDHT-G series is inherently sticky, so not necessary to use additional adhesive coating which deteriorates thermal performance.
IDHT-G series is electrically insulated and stable from –40℃ to 200℃.
Cooling Components to the Chassis or Frame
High Speed Mass Storage Drives
RDRAM Modules
Micro Processors, Memory Chips and Chipsets
Thermal Solution for Heat Pipe
Automotive Engine Control Units
Telecommunication Hardwares
Item
Content
|
IDHT G Series (1.5~2.0W/m∙K) | ||||||
---|---|---|---|---|---|---|---|
(S)-G1540 | (S)-G1550 | (S)-D1550 | G1560 | G1560BV | (S)-G1850 | G1 | |
Color | Gray | Gray | Dark Gray | Gray | Sky Blue | Gray | Gray |
Thickness (mm) | 0.5~20.0 | 0.5~20.0 | 0.5~20.0 | 0.5~10.0 | 0.5~15.0 | 0.5~20.0 | 0.5~10.0 |
Thermal Conductivity (W/m·K) | 1.5 | 1.8 | 2.0 | ||||
Hardness (Shore 00) | 40 | 50 | 50 | 60 | 60 | 50 | < 40 |
Specific Gravity | 2.6 | 2.57 | 2.57 | 1.8 | 1.8 | 2.57 | 2.5 |
Volume Resistivity (Ω·cm) | - | 1.0×1014 | 1.0×1014 | 1.0×1011 | 1.0×1011 | 1.0×1014 | 1.0×1011 |
Voltage Breakdown (kV) | - | - | - | 5.1 | 5.1 | - | > 6 |
Service Temp. (℃) | -60 ~ 200 | -60 ~ 200 | -60 ~ 200 | -40 ~ 200 | -40 ~ 200 | -60 ~ 200 | -40 ~ 200 |
Item
Content
|
IDHT G Series (3.0~6.0W/m∙K) | ||||||||
---|---|---|---|---|---|---|---|---|---|
G3030 | G3050 | G3050PV | (S)-G3060 | G4050 | G5050 | (S)-G5070 | G6050 | G6050BV | |
Color | Gray | Gray | Pink | Gray | Gray | Gray | Gray | Gray | Sky Blue |
Thickness (mm) | 0.5~10.0 | 0.5~3.5 | 0.5~3.5 | 0.25~11.0 | 0.5~10.0 | 0.5~10.0 | 0.5~20.0 | 0.5~10.0 | 0.5~10.0 |
Thermal Conductivity (W/m·K) | 3.0 | 4.0 | 5.0 | 6.0 | |||||
Hardness (Shore 00) | 30 | 50 | 50 | 60 | 60 | 50 | 70 | 50 | 50 |
Specific Gravity | 2.8 | 2.86 | 2.86 | 2.95 | 1.8 | 3.0 | 3.15 | 3.0 | 3.0 |
Volume Resistivity (Ω·cm) | 1.0×1011 | 1.0×1011 | 1.0×1011 | 1.0×1012 | 1.0×1011 | 1.0×1011 | 1.0×1013 | 1.0×1011 | 1.0×1011 |
Voltage Breakdown (kV) | > 6 | > 6 | > 6 | - | 5.1 | - | - | - | - |
Service Temp. (℃) | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -30 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 |
1 Heat Transfer : none or (S)
2 Thickness (mm)
3 Type (G : gel type)
4 Powder Filler (****)
5 Width (mm)
6 Length (mm)
7 Tape type : A(100㎛), A1(50㎛), C(none)
8 Tacky Type : O(One Side Tacky), B(Both Side Tacky)
9 None : Rectangular type, S : Shape type
Thickness : 0.5mm
Powder Filler : G1550
Width : 210mm
Length : 300mm
Tape Type : C(none)
Rectangular type
Thickness : 0.5mm
Powder Filler : G1560
Width : 210mm
Length : 300mm
Tape Type : A(100㎛)
Shape type
IDHT-S1 has high thermal conductivity of 4.0W/m·K to produce low thermal impedance.
IDHT-S1 is electrically insulating, stable from –30℃ to 200℃.
Available in various thickness from 0.1mm to 0.35mm
IDHT-S1 does not require reinforcement.
Not only the lowest thermal resistance but the highest dielectric strength are the distinctive characteristics of IDHT-S1.
CPU / Heat Sink
Power Devices, Voltage Regulators / Heat Sink
PCB / Heat Sink
PCB / Case or Chassis
CD ROM drive / Case
PCB / PCB
Content | IDHT-S1 |
---|---|
Color | White |
Thickness (mm) | 0.1 ~0.35 |
Hardness (Shore A) | 60 |
Specific Gravity | 2.7 |
Thermal Conductivity (W/m·K) | 4.0 |
Volume Resistivity (Ω·cm) | 1.0×1011 |
Voltage Breakdown (kV) | 5.1 |
Tensile Strength (MPa) | 15 |
Service Temp. (℃) | - 30 ~ 200 |
1 Heat Transfer
2 Thickness (mm) : 010 means 0.10mm
3 Type (S : sheet type)
4 Powder Filler
5 Width (mm)
6 Length (mm)
7 Tape type
8 S : Press, N : None Press