Total EMC / Thermal Products
Excellent grounding characteristics from a wide area of grounding
Excellent electrical conductivity
The stabilization of components due to mounting levelly
Excellent reliability(repeated compression, brine-atomizing test pass)
Precise reel packaging for the accurate work
Superior thermo-stable characteristics
High adhesion after SMT
Impedance matching function of PCB or FPCB
Excellent Thermal Transfer
Excellent ESD (Electrostatic discharge)
Cushion and anti-shock after SMT
EMI noise attenuation its power loss property
Item | Test Method | Properties | |
---|---|---|---|
Material Description |
Base Material | - | Silicone rubber / PI Film |
Color | Visual | Silver & Gold | |
Operation Temp. | - | -40 ~ 120℃ |
|
Service Temp. | Ref. Soldering condition | -40 ~ 265℃ | |
Electric Resistance (Ω) | Origin | HIOKI 3540 mΩ HITESTER | Max. 0.1 |
Thermo-hygrostat | Max. 0.1 | ||
Brine Atomizing | Max. 0.1 | ||
Thermal Shock | Max. 0.1 | ||
Standard Size (mm) | Width | Digital Calipers | Order Size |
Height | |||
Length | |||
Adhesion Strength (gf/cm) | Push Pull Gauge Speed : 0.5mm/sec |
Length: Min. 150gf / Width: Min. 200gf |
|
Compression-Deflection Rate (%) | 20% Compression | Min. 95 | |
30% Compression, 48hr | Min. 90 | ||
Flammability | UL 94 | UL 94-V1 | |
RoHS & Halogen Free | Pb, Cd, Hg, Cr+6, PBBs, PBDEs, Br, Cl | N.D. |
1Serial Number
2W : Wrapping
3Width (mm)
4Height (mm)
5Length (mm)
6Type : H[Sn plated Film with a hole]
HG[Au plated Film with a hole]
N[without a hole]
GN[Au plated Film without a hole]
Wrapping
Width : 4mm
Height : 5mm
Length : 6mm
Type : H