DOOSUNG CO., Ltd.

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PRODUCTS

Total EMC / Thermal Products

IDCF Series

Structure and Features

IDCF is recently developed by DSIC from SMD

Finger Strip for the use PCB featuring excellent resilience and electrical properties.

Specifications

Specifications
Item Test Method Properties
Material description Base Material - Conductive Silicone & Au plated Cu
Color Visual Black/Dark gray/Gray
Service Temp (℃) Internal Test method 280
Service Temp. (℃) Internal Test method - 40 ~ + 150
Electric Resistance (Ω) Origin HIOKI 3540 mΩ HITESTER Max. 1.0
Temp. & Humi. (50℃/95%RH) Max. 1.0
Salt Spray Max. 1.0
Thermal Shock Max. 1.0
Standard Size (mm) Width Digital Calipers Order Size
Height
Length
PCB Adhesion Strength (gf/mm) Push Pull Gauge
Speed : 0.5mm/sec
Length: Min. 150gf
/ Width: Min. 200gf
Compression-Deflection Rate (%) 20% Compression, 10,000회 Min. 95
30% Compression, 48hr Min. 90
Flammability UL 94 UL 94-V1
RoHS & Halogen Free Pb, Cd, Hg, Cr+6, PBBs, PBDEs, Br, Cl N.D.

How to Order

P/N :
IDCF 1
-
AAA 2
-
BBB 3
T -
CCC 4
-
DDD 5
-
EEE 6
-
FFF 7
  • 1Serial Number

    2None : Hard Type , C : Soft Type

    3Height (mm)

    4Conductive Silicone Type : SC
    Non Conductive Silicone Type : GS (Gap Supporter)

  • 5Width (mm)

    6Length (mm)

    7G : Au Plated Cu Foil

[ For Example ]
IDCF-0.7T-SC-2.5-1-G

Hard Type

Width : 2.5mm

Height : 0.7mm

Length : 1mm

Type : G

IDCF-C-0.4T-SC-2-1-G

Soft Type

Width : 2mm

Height : 0.4mm

Length : 1mm

Type : G